Lexicon DIY-Knowledge

Artificial resin bonding


Colla de resina artificial

Colle de résine artificielle

Chipboard is produced by using artificial-resin glue or plastic adhesive as bonding agent.
Commercially available boards are usually veneered, coated or untreated.
In order to make it easier for users to choose the right type, these boards are classified in accordance with their bonding type and the emission class.
Chipboards are available in three different bonding types.
V 20 boards were bonded with carbamide or urea resins and are used for all furniture types and internal fittings which are exposed to low atmospheric moisture.
V 100 boards were bonded with phenolic or resorcinol formaldehyde resins and can be used in humid environments.
V 100 G boards contain additional fungicides which allow them to be used in places with high moisture content (e.g. front doors, roof boarding, ventilation and heating ducts).
The emission classes are based on the formaldehyde content (harmful substance).
E1 = max. 0.1 ppm (parts per million)
can be used and processed without restrictions, also if unsealed.
E2 = 0.1 ? 1.0 ppm
Should have coating on both surfaces.
E3 = 1.0 ? 2.3 ppm
Should be completely coated to prevent any formaldehyde from escaping.
The designation E0 is often found. This means that the chipboard does not contain any formaldehyde.